We specialize in high resolution, high precision, small spot size, laser beam machining for medical, semiconductor, display, and microelectronics applications. Patterning Transparent Conductive Oxides (TCO) such as Indium Tin Oxide (ITO) is an application of great interest to us. We work with both crystalline and polycrystalline silicon, such as resizing silicon wafers, drilling microvia holes, scribing solar cells, isolation scribes and channels.
We laser process: displays, solar cells, resistors and sensors (transducers).
We perform precision micromachining on all microelectronic substrates such as ceramic, silicon, diamond, BeO and all others. Examples of microelectronic micromachining include cutting, scribing and drilling all metals, ceramics and plastics, patterning displays of glass or plastic, cutting/drilling/machining thin stainless steel, and trimming hybrid resistors.
We perform laser micromachining:
* Cutting Thin Materials - any metal or plastic (<1mm thickness)
* Cutting Silicon and MEMS Devices (silicon wafer resizing)
* Patterning ITO (glass & plastic substrates)*
* Drilling Holes & Slotting (<1mm depth)
* Trimming Resistors
As a shop service, we are happy to do prototyping, quick turnaround jobs, volume production, and customer samples to prove feasibility. We also do applications R&D to develop a working laser process for you.
We sell systems as well as offering a laser processing service.
We have gotten to be world leaders in the things we do by honing our skills in designing and building our own laser machines. Then we perfect the application by processing parts supplied by our customers in our Job Shop. Finally, we offer for sale these carefully honed laser tools.
You may call, fax or e-mail your requirements. You can e-mail us a dxf, or sketch in any format . . . We will quote on a turnkey basis. Prototypes are welcome.
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